High speed chip-to-chip interface protocol with scalable bandwidth, low latency and reliable data transfer over serial links. The latest generation supports up to 1.2Tbps bandwidth with support for NRZ and PAM4 serial links. Learn more
Die-to-Die Controller IP offers unique value proposition in terms of low power, high throughput and low latency links enabling faster time to integration for heterogenous chiplet connections in wired communications, AI and HPC applications.
The HBM2/2E IP is suitable for applications involving graphics, high-performance computing, high-end networking, and communications that require very high bandwidth, lower latency and more density. Learn more